Oxford PlasmaPro 100 Cobra ICP
Oxford PlasmaPro 100 Cobra ICP
TOOL ID: DE-5
The PlasmaPro 100 Cobra ICP RIE system utilizes a high-density inductively coupled plasma to achieve fast etch rates. The process modules offer excellent uniformity, high-throughput, high-precision and low-damage processes for wafer sizes up to 4″ or 100mm.
The tool is connected to the following gases: BCl3, Cl2, Ar, O2, SF6, CF4, and CHF3.
Oxford PlasmaPro 100 Cobra ICP
