Equipment/Instrumentation

HB100 Wire Bonder

HB100 Wire Bonder

TOOL ID: BE-06
LOCATION: Packaging Lab

 

The HB100 is an ultrasonic wire bonder offering a high-precision X-Y-Z and Theta control. All parameters, such as bonding force, ultrasonic power, time & temperature are controlled digitally. The bonder offers reliable wire and ribbon handling through vertical feed and motorized clamp. The Model HB100 employs the ultrasonic bonding method that mainly depends on four variables to

connect two metals: force, ultrasonic energy, time, and heat. FORCE is introduced to promote the plastic flow (deformation) and intimate coupling between the bonding tool, the wire, and the substrate. ULTRASONIC (63 kHz, optional 100kHz) scrubbing displaces surface contaminants and enforces the

metal to metal coupling. TIME for the bonding process is set to sufficient duration to cause solid-state diffusion. HEAT is only used with gold wire. It eliminates surface contaminants, leading to stronger connections.

HB100 Wire Bonder