EVG 510 Wafer Bonder
EVG 510 Wafer Bonder
TOOL ID: BE-01
The EVG501 Wafer Bonding System is a highly flexible R&D system that can handle small substrate pieces up to 100 mm wafers. The new tool supports a variety of bonding processes, such as anodic, glass frit, eutectic, diffusion, fusion, solder, and adhesive bonds, as well as other thermal processes, including oxide removal and high temperature bakes under a controlled atmosphere. The system also offers quick re-tooling with a conversion time of less than five
minutes, making it ideal for universities and R&D as well as small-volume production applications.
Features
- R&D and pilot line production
- Bonds up to 10 kN force at temperatures up to 450°C
- Real and low-force wafer wedge compensation system for highest yield
- Large process window: temperature uniformity <+/- 1% and pressure uniformity
<+/- 5%
EVG 510 Wafer Bonder
